SiC wafers
Product-grade precision
We deliver 2.2-2.3 wafers per mm with four quality grades aligned to your needs: MOSFET Production, Diode Production, R&D, and Mechanical Grade. Our laser-cut wafers eliminate bow, warp, and subsurface damage that plague traditional manufacturing.
KEY BENEFITS:
- Industry-leading yield per ingot
- 90% reduction in material waste
- Zero bow and warp effects
- Minimal subsurface damage
Laser wafering services
Manufacturing excellence as a service
No upfront equipment costs. No capacity risk. Just superior wafers delivered to your specifications. Our service model turns fixed expenses into flexible economics that scale with your success.
WHAT WE HANDLE:
- Laser slicing with precision geometry control
- Grinding and surface preparation
- Chemical mechanical polishing (CMP)
- Metrology and wafer mapping
Custom Solutions
Tailored to your needs
Every production challenge is unique. Our team works with you to develop custom wafering solutions that optimize for your specific materials, geometries, and quality requirements.
OUR CAPABILITIES:
- Custom material processing
- Prototype development and testing
- Process optimization consulting
- Technical support and training